Analytical Model for Atomic-Layer Deposition of Thin Films on the Walls of Cylindrical Holes with a Relatively High Aspect Ratio
- Авторы: Fadeev A.V.1, Rudenko K.V.1
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Учреждения:
- Physicotechnological Institute
- Выпуск: Том 63, № 8 (2018)
- Страницы: 1228-1235
- Раздел: Physical Electronics
- URL: https://journals.rcsi.science/1063-7842/article/view/201875
- DOI: https://doi.org/10.1134/S1063784218080054
- ID: 201875
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Аннотация
A theoretical model that predicts the thickness of a film grown on the walls of high-aspect-ratio cylindrical hole using the atomic-layer deposition is proposed. The model can be used to calculate the critical time of precursor supply needed for conformal coating of the walls. An analytical model is derived to estimate the minimum time of precursor supply versus parameters of the technological process.
Об авторах
A. Fadeev
Physicotechnological Institute
Автор, ответственный за переписку.
Email: AlexVFadeev@gmail.com
Россия, Moscow, 117218
K. Rudenko
Physicotechnological Institute
Email: AlexVFadeev@gmail.com
Россия, Moscow, 117218
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