X-Ray Spectral Analysis of the Effect of Electronic Interaction and Electromigration on the Kinetics and Formation of the Structure of Contact Interlayers

Resumo

The results are presented from investigating the effect electromigration and indium impurities in tin have on the kinetics and the formation of structures in contact interlayers in the (Sn + 3% In)–Bi system. The formation of phases in the structure of transition zones is analyzed for the first time using X-ray photoelectron spectrometry. It is found that the chemical state of components is retained at any point of the contact zone and corresponds strictly to the metallic state of the metals in contact. It is established that indium impurities and the current that flows during contact melting affect both the kinetics of the process and the formation of structures in the liquid contact interlayer, as is observed on the concentration distribution.