Effect of Recovery and Recrystallization on the Hall–Petch Relation Parameters in Submicrocrystalline Metals: I. Experimental Studies

Resumo

Yield strength σy, macroelastic limit σ₀, and effective grain-boundary hardening coefficient K_eff in the Hall–Petch relation (\({\sigma _y} = {\sigma _0} + {K_{eff}}/\sqrt d \)) in the submicrocrystalline (SMC) materials produced by equalchannel angular pressing are experimentally studied. It is shown that, as compared to parameter σ₀ and K in the Hall–Petch relation for coarse-grained metals, the SMC metals are characterized by higher values of σ0 and lower values of K_eff. The critical grain size (d₁) at which Keff in the σ_y–d^–1/2 relations of SMC materials changes falls in the range 0.2–0.5 μm. The dependences of macroelastic limit σ₀ and coefficient K_eff on the annealing temperature are found to be determined by recrystallization. If abnormal grain growth develops in annealing of SMC metals, anomalous hardening is detected and a nonmonotonic temperature dependence of coefficient K_eff takes place. In the case of conventional recrystallization at a high annealing temperature, SMC metals exhibit a smooth decrease in σ₀ and an increase in K_eff to the values of K characteristic of coarsegrained materials.