Molecular Dynamics Study of the Point Defect Migration in the Ordered CuPt Alloy during Deformation
- Авторлар: Poletaev G.1, Starostenkov M.1, Zorya I.2, Il’ina M.3
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Мекемелер:
- Polzunov Altai State Technical University
- Siberian State Industrial University
- Barnaul Branch, Financial University under the Government of the Russian Federation
- Шығарылым: Том 2019, № 10 (2019)
- Беттер: 927-931
- Бөлім: Physical Foundations of Strength and Plasticity
- URL: https://journals.rcsi.science/0036-0295/article/view/173513
- DOI: https://doi.org/10.1134/S0036029519100227
- ID: 173513
Дәйексөз келтіру
Аннотация
Abstract—The migration energies of a vacancy and an interstitial atom in the ordered CuPt alloy are calculated using molecular dynamics simulation. A high interstitial atom migration anisotropy is detected: as a rule, an interstitial atom migrates along the (111) planes containing copper atoms. A similar anisotropy is also observed for the vacancy migration during elastic tensions along these planes.
Негізгі сөздер
Авторлар туралы
G. Poletaev
Polzunov Altai State Technical University
Хат алмасуға жауапты Автор.
Email: gmpoletaev@mail.ru
Ресей, Barnaul, 656038
M. Starostenkov
Polzunov Altai State Technical University
Email: gmpoletaev@mail.ru
Ресей, Barnaul, 656038
I. Zorya
Siberian State Industrial University
Email: gmpoletaev@mail.ru
Ресей, Novokuznetsk, 654006
M. Il’ina
Barnaul Branch, Financial University under the Government of the Russian Federation
Email: gmpoletaev@mail.ru
Ресей, Barnaul, 656036
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