Two-Side Growth of the Cu9Ga4 Phase during the Interfacial Reactions between Sn–Ag–Cu–Ga Solders and Copper Substrates
- Autores: Wenjing Wang 1, Chen H.1, Chen J.2, Gong L.2, Wang H.1
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Afiliações:
- Institute of Engineering Research, Jiangxi University of Science and Technology
- School of Materials Science and Engineering, Jiangxi University of Science and Technology
- Edição: Volume 120, Nº 5 (2019)
- Páginas: 454-458
- Seção: Structure, Phase Transformations, and Diffusion
- URL: https://journals.rcsi.science/0031-918X/article/view/168479
- DOI: https://doi.org/10.1134/S0031918X18090168
- ID: 168479
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Resumo
Interfacial reactions between Sn–3.0Ag–0.5Cu–1.0Ga/1.5Ga in wt.% solders and Cu substrates have been investigated. The solder and substrate couples were annealed at 180°C for 6, 12, 18, and 24 days. Different layers of intermetallic compounds have been found to form, such as Cu6Sn5 and Cu9Ga4. Sn was also observed within the interfacial layer during the annealing. The Cu6Sn5 phase and the Cu9Ga4 phase were observed to form by turns from the substrate into the solder. The Cu9Ga4 phase grew from both the solder side and the intermetallics side. Growth of the Cu9Ga4 phase was found to depend on the Ga diffusion and the availability of the Cu6Sn5 phase.
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Sobre autores
Wenjing Wang
Institute of Engineering Research, Jiangxi University of Science and Technology
Email: wanghang84@hotmail.com
República Popular da China, GanzhouJiangxi, 341000
HuiMing Chen
Institute of Engineering Research, Jiangxi University of Science and Technology
Email: wanghang84@hotmail.com
República Popular da China, GanzhouJiangxi, 341000
Jinshui Chen
School of Materials Science and Engineering, Jiangxi University of Science and Technology
Email: wanghang84@hotmail.com
República Popular da China, GanzhouJiangxi, 341000
Liukui Gong
School of Materials Science and Engineering, Jiangxi University of Science and Technology
Email: wanghang84@hotmail.com
República Popular da China, GanzhouJiangxi, 341000
Hang Wang
Institute of Engineering Research, Jiangxi University of Science and Technology
Autor responsável pela correspondência
Email: wanghang84@hotmail.com
República Popular da China, GanzhouJiangxi, 341000